By tf-lawyer.com The Chinese American Semiconductor Professional Association (CASPA) recently held a Global Semiconductor Forum, attracting industry leaders, experts, executives, and investors from around the world. The theme of the forum was “Democratizing Artificial Intelligence,” focusing on AI-driven technological innovations and their profound impacts on the semiconductor supply chain. Attendees discussed the opportunities and challenges the semiconductor industry faces in the age of AI, as well as anticipated future trends in technology development.
Artificial intelligence, as a core component of the latest technological revolution, is transforming various industries, with particularly significant effects in the semiconductor sector. During the forum, Dan Armbrust, one of the founders of Silicon Catalyst and a seasoned semiconductor investor, elaborated on how AI technology is fostering continuous innovation and transformation within the semiconductor industry.
Armbrust emphasized that the rapid advancement of AI is driving an exponential increase in demand for semiconductors, particularly in fields such as deep learning, autonomous driving, and smart manufacturing, which require more efficient computational capabilities and low-power chip designs. This urgent demand for high-performance chips is propelling the entire semiconductor industry toward higher technological levels, fostering substantial research investment in chip architecture, material innovation, and packaging technology.
“AI is not only making a profound impact at the application level; the semiconductor industry, as a foundational technology, stands at the forefront of historical changes,” Armbrust stated. “The evolution of AI and machine learning has made the semiconductor industry more complex and critical than ever before, and we are witnessing a new gold rush in this space.” He noted that innovation in the industry is shifting from traditional Moore’s Law to AI-driven applications, a transition that will continue to influence the future directions of technological innovation.
Since its establishment in 1991, CASPA has been committed to connecting semiconductor professionals globally, fostering collaboration, and supporting industry innovation. At the forum, current CASPA President Dr. Hsiao Chih-Pin reflected on the organization’s achievements over the past 30 years and highlighted the importance of global collaboration for the future of the semiconductor industry.
“From its inception, CASPA has aimed to build bridges for global Chinese semiconductor professionals and promote technical exchange and cooperation,” Dr. Hsiao noted. “Now, we find ourselves at an unprecedented transformative moment for the semiconductor industry, particularly under the rapid development of generative artificial intelligence. It is crucial that we collaborate globally in this landscape. We will continue to uphold this mission by connecting the world’s technical talents to tackle the challenges and opportunities of the AI era together.”
Participants also expressed concerns regarding the innovation bottlenecks facing the semiconductor industry. As Moore’s Law approaches its physical limits, traditional technologies are struggling to sustain ongoing improvements in chip performance. Addressing challenges related to power density, heat dissipation, and energy efficiency has become an urgent task for the semiconductor industry.
“In the next five to ten years, the industry must find innovative solutions that break existing physical limitations, which may involve the use of new materials and fundamental changes to chip architecture,” Armbrust warned.
The forum recognized the dedication of volunteers who have consistently contributed to CASPA’s mission, with several volunteers reflecting on their experiences and envisioning future growth for the semiconductor industry and the tech community. CASPA has attracted many volunteers from around the globe, who contribute their expertise through event planning and technical support while showcasing their deep emotional connection to the CASPA family.
